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Course Description

This is 8-week certificate program on Advanced IC Packaging. This course is designed to provide you with the essential knowledge and skills to enter and excel in the rapidly growing semiconductor industry. We will journey from the fundamental principles and history of packaging to the cutting-edge technologies that are enabling the next generation of electronics. This program blends foundational theory with practical industry insights, preparing you for a successful career in this exciting field. 

Learner Outcomes

Upon successful completion of this 8-week certificate, you will be able to:

  • Explain the history and fundamental principles of IC packaging.

  • Analyze advanced packaging techniques, including 2.5D/3D integration and thermal management.

  • Identify key processes in failure analysis, reliability testing, and counterfeit detection.

  • Describe the modern semiconductor ecosystem and current industry trends.

  • Apply learned concepts to practical scenarios through virtual labs and industry case studies.

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Enroll Now - Select a section to enroll in

Section Title
Semiconductor Advanced Packaging and Inspection
Section Schedule
Date and Time TBA
Course Fee(s)
Registration fee non-credit $0.00
Drop Request Deadline
TBD
Transfer Request Deadline
TBD
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